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 MBRA130LT3 Surface Mount Schottky Power Rectifier
SMA Power Surface Mount Package
This device employs the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
Features http://onsemi.com
* * * * * * * * * * * * * *
Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Pb-Free Package is Available Case: Molded Epoxy Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 70 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Cathode Lead Indicated by Either Notch in Plastic Body or Polarity Band Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V)
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 105C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 105C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage Temperature Operating Junction Temperature Symbol VRRM VRWM VR IO IFRM Value 30 Unit V
SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES, 30 VOLTS
Mechanical Characteristics:
SMA CASE 403D PLASTIC
MARKING DIAGRAM
B1L3 ALYW
MAXIMUM RATINGS
B1L3 A L Y W
= Device Code = Assembly Location = Wafer Lot = Year = Work Week
ORDERING INFORMATION
1.0 2.0 A A MBRA130LT3G SMA (Pb-Free) 5000/Tape & Reel Device MBRA130LT3 Package SMA Shipping 5000/Tape & Reel
IFSM
25
A For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Tstg TJ
-55 to +150 -55 to +125
C C
Voltage Rate of Change, (Rated VR, TJ = 25C) dv/dt 10,000 V/ms Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
(c) Semiconductor Components Industries, LLC, 2005
1
February, 2005 - Rev. 7
Publication Order Number: MBRA130LT3/D
MBRA130LT3
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance -- Junction-to-Lead (Note 1) Thermal Resistance -- Junction-to-Ambient (Note 1) Symbol RqJL RqJA Value 35 86 Unit C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2) see Figure 2 Maximum Instantaneous Reverse Current see Figure 4 (VR = 30 V) (VR = 15 V) (IF = 1.0 A) (IF = 2.0 A) IR VF TJ = 25C 0.41 0.47 TJ = 25C 1.0 0.4 TJ = 100C 0.35 0.43 TJ = 100C 25 12 mA Volts
1. Mounted on 2 Square PC Board with 1 Square Total Pad Size, PC Board FR4. 2. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%.
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
10
I F, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
TJ = 125C 1.0 TJ = 85C TJ = 25C TJ = -40C 0.1 0 0.2 0.4 0.6 0.8 1.0
TJ = 125C 1.0
TJ = 85C TJ = 25C 0.1 0 0.2 0.4 0.6 0.8 1.0
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100E-3 I R , REVERSE CURRENT (AMPS)
100E-3 I R , MAXIMUM REVERSE CURRENT (AMPS)
10E-3 TJ = 125C TJ = 85C
10E-3
1.0E-3
1.0E-3
TJ = 85C TJ = 25C
100E-6
100E-6
10E-6 TJ = 25C 0 10 20 30
10E-6
1.0E-6
1.0E-6
0
10
20
30
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
http://onsemi.com
2
MBRA130LT3
PFO , AVERAGE POWER DISSIPATION (WATTS) 2.0 IO , AVERAGE FORWARD CURRENT (AMPS) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 40 SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20 dc FREQ = 20 kHz 0.6 SQUARE WAVE 0.5 0.4 Ipk/Io = 10 0.3 Ipk/Io = 20 0.2 0.1 0 Ipk/Io = 5 Ipk/Io = p dc
60
80
100
120
140
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
TL, LEAD TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) T, TIME (s) 1.0E+0
Figure 6. Forward Power Dissipation
100E-3
10E-3
1.0E-3
100E-6
10E-6
100E-6
1.0E-3
10E-3
100E-3 T, TIME (s)
1.0E+0
10E+0
100E+0
1.0E+3
Figure 7. Thermal Response
1000
C, CAPACITANCE (pF)
TJ = 25C 100
10
1.0
0
5.0
10
15
20
25
30
35
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 8. Capacitance
http://onsemi.com
3
MBRA130LT3
PACKAGE DIMENSIONS
SMA CASE 403D-02 ISSUE B
S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02. DIM A B C D H J K S INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.095 0.050 0.064 0.002 0.006 0.006 0.016 0.030 0.060 0.190 0.220 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.41 1.27 1.63 0.05 0.15 0.15 0.41 0.76 1.52 4.83 5.59
D
B
POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES)
C
K
J
H
SOLDERING FOOTPRINT*
4.0 0.157
2.0 0.0787
2.0 0.0787
SCALE 8:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
4
MBRA130LT3/D


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